If technologies such as Liquid Crystals (LC) and thin film filters (TFF) are the pearls of the Lightwaves2020 products, then vertical integration is the thread that strings them together. After several decades’ experience in improving packaging technology, Lightwaves2020 engineers have mastered every packaging technique, from standard epoxy adhesives to InSn soldering, proprietary glass soldering and precision laser welding.
Utilizing these technologies, Lightwaves2020 engineers have not only shrunk the size of the components they produce, but have been able to integrate several functions in a single package. By greatly reducing the device count inside our intelligent modules, our modules are the most compact examples on the market and exhibit superior performance. With hybrid vertical integration of active and passive components, we build the world’s smallest erbium doped fiber amplifiers and LC variable optical attenuators.